VPG+ 200
VPG+400

VPG+ 800
VPG+1400

ULTRA

专业掩膜制版系统
大型掩膜制版系统
半导体激光掩膜版生产设备

THE MULTI-PURPOSE VOLUME PATTERN GENERATORS
光学系统上的创新与突破-平行化光刻技术制版系统

LARGE–AREA VOLUME PATTERN GENERATORS
大尺寸掩膜版和显示器生产工具

THE SEMICONDUCTOR LASER MASK WRITER
PSM 二次套刻解决方案

VPG+200和400非常适合生产掩模板以及对应i-line光阻,例如SU-8和IP3600的应用,超高速曝光引擎和自动对准能力共同为系统提供卓越的分辨率、优秀的影像质量和快速的吞吐量。

VPG+200和400系列对于较小曝光区域的典型应用,包括微机电系统(MEMS)、先进封装、3D集成、LED生产和化合物半导体等领域。

The successful VPG (Volume Pattern Generator) family – with an installation base of more than 50 worldwide – has evolved once more. Since its inception, the VPG product line has continuously been improved further as technology advanced. The newly integrated high-speed spatial light modulator now represents a quantum leap in performance – a development that is reflected in an upgraded product name: VPG+.

The Small Area VPG+: The best of both worlds
Our VPG+ systems are available in versions for small and large area exposures. All of them share the same powerful technology. The VPG+ 200 and VPG+ 400 are Heidelberg Instruments’ most advanced small and midsize high-speed exposure systems. While their principle of operation is based on the technology employed by the company’s large area VPG platforms, they also benefit from our vast experience in small area lithography.

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

Our VPG+ 200 and 400 systems present a perfect solution for applications that use i-line resists such as SU-8 and IP 3600, for example for rapid prototyping applications in microfluidics. In combination with their high speed and resolution, the VPG+ 200 and 400 therefore provide an excellent alternative to an i-line stepper.

Typical applications for the smaller exposure area members of the VPG+ family include such demanding fields as MEMS, advanced packaging, 3D integration, LED production, and compound semiconductors.

我们的大尺寸VPG+系统非常适合用于先进封装、半导体、显示器、彩色滤光片、LED和触控面板等应用的掩膜版制作。系统支持所有工业数据格式,并提供Mura优化功能,确保优秀的CD均匀性和分辨率,封闭环境室符合最严格的高级掩膜版技术使用的要求。由于速度快、系统价格具有吸引力且运行成本低,大尺寸VPG+系列是大尺寸掩膜版应用中最具生产力的解决方案。

VPG+1400是我们最大的系统,尤其适用于显示器领域的应用,如TFT数组、彩色滤光片和ITO,并具有特别强大的环境室、分差干涉仪,分辨率高达1.2nm,以及先进的Mura校正能力。

Our Large Area VPG+ systems are perfectly equipped for applications such as photomask fabrication for advanced packaging, semiconductors, displays, color filters, LEDs, and touch panel applications. The systems support all industrial data formats and offer Mura optimization functions ensuring excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for use in advanced photomask technology. Because of their speed, attractive system price, and low running costs, the Large Area VPG+ series represents the most productive solution for large area photomask applications.

The VPG+ 1400 is our largest system and particularly aimed at applications in the display industry: FPD applications like TFT-arrays and color filters, and ITO. The VPG+ 1400 features a particularly powerful environmental chamber, a differential interferometer with a resolution down to 1.2 nm, and advanced Mura correction capabilities.

ULTRA系统针对半导体产业制造掩膜版,提供了经济实惠的激光直写生产掩膜版方案,拥有高通量、高精度和结构均匀性,以及极其精确的对准功能。由于其现代化、紧凑的结构,您可以轻松将系统整合到现有的掩膜版制造基础设施中。

现今,掩模版在半导体器件制造中仍然是重要的组成环节,被广泛应用在电源、微控制器、LED照明、物联网、微机电、汽车工业等领域。 ULTRA系统支持结构尺寸低于500nm,速度最快高达每分钟325 mm²或580 mm²(取决于写入模式),同时具有优秀的均匀性、高质量图像、多层套刻精度以及重复定位精度。

The ULTRA specifically addresses the production of mature semiconductor photomasks. It provides an economical mask writer solution with all the features you require for high throughput, high precision and structure uniformity, and extremely accurate alignment. With its modern, compact build, you can easily incorporate the system into an existing mask shop infrastructure.

Mature photomasks continue to be a vital component in semiconductor device fabrication, being used in power management, microcontrollers, LED lighting, the IOT, MEMS, the automotive industry, to name but a few. The ULTRA serves this market with structure sizes down to 500 nm and write speeds up to 325mm² or 580mm² per minute depending on write mode, while featuring excellent values for CD, image quality, overlay, and registration.

KEY FEATURES

Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively Minimum feature size: Down to 0.75 μm Address grid: Down to 12.5 nm Maximum write speed (at structure size 4 um): 13500 mm²/min Exchangeable write modes Real-time autofocus system High power DPSS laser with 355 nm wavelength Camera system for metrology and alignment Closed-loop climate chamber Automatic substrate loading system Stage map correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber)

Maximum substrate size: 800 x 800 mm² / 1100 x 1100 mm² / 1400 x 1400 mm² Minimum feature size: Down to 0.75 μm Maximum write speed (at 4 μm feature size): 16500 mm² / min Real-time autofocus system High power DPSS laser with 355 nm Camera system for metrology and alignment Closed-loop environmental chamber Automatic substrate loading system Stage map correction Mura correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber files)

Maximum substrate size: 9" x 9"; optional: 17" x 17" Minimum feature size: 500 nm Address grid down to 5 nm High-speed optical engine Customized UV optics (0.9 NA objective lens) 20 nm line edge roughness Input formats: All standard formats, e.g. GDSII, OASIS Overlay of 30 nm Economical, high-power UV laser 100 nm 2nd layer alignment Automatic mask loader CD uniformity of 30 nm SECS / GEM protocol High-speed data path for all types of pattern

Application

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor