VPG+ 200
VPG+400

VPG+ 800
VPG+1400

VPG 300 DI

专业掩膜制版系统
大型掩膜制版系统
先进激光直写圖型发生器

THE MULTI-PURPOSE VOLUME PATTERN GENERATORS
光学系统上的创新与突破-平行化光刻技术制版系统

LARGE–AREA VOLUME PATTERN GENERATORS
大尺寸掩膜版和显示器生产工具

THE MASKLESS DIRECT IMAGER VPG 300 DI
FOR HIGH ACCURACY AND HIGH RESOLUTION MICROSTRUCTURES
快速展现高精度、高分辨率的微型结构

VPG+200和400非常适合生产掩模板以及对应i-line光阻,例如SU-8和IP3600的应用,超高速曝光引擎和自动对准能力共同为系统提供卓越的分辨率、优秀的影像质量和快速的吞吐量。

VPG+200和400系列对于较小曝光区域的典型应用,包括微机电系统(MEMS)、先进封装、3D集成、LED生产和化合物半导体等领域。

The successful VPG (Volume Pattern Generator) family – with an installation base of more than 50 worldwide – has evolved once more. Since its inception, the VPG product line has continuously been improved further as technology advanced. The newly integrated high-speed spatial light modulator now represents a quantum leap in performance – a development that is reflected in an upgraded product name: VPG+.

The Small Area VPG+: The best of both worlds
Our VPG+ systems are available in versions for small and large area exposures. All of them share the same powerful technology. The VPG+ 200 and VPG+ 400 are Heidelberg Instruments’ most advanced small and midsize high-speed exposure systems. While their principle of operation is based on the technology employed by the company’s large area VPG platforms, they also benefit from our vast experience in small area lithography.

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

Our VPG+ 200 and 400 systems present a perfect solution for applications that use i-line resists such as SU-8 and IP 3600, for example for rapid prototyping applications in microfluidics. In combination with their high speed and resolution, the VPG+ 200 and 400 therefore provide an excellent alternative to an i-line stepper.

Typical applications for the smaller exposure area members of the VPG+ family include such demanding fields as MEMS, advanced packaging, 3D integration, LED production, and compound semiconductors.

我们的大尺寸VPG+系统非常适合用于先进封装、半导体、显示器、彩色滤光片、LED和触控面板等应用的掩膜版制作。系统支持所有工业数据格式,并提供Mura优化功能,确保优秀的CD均匀性和分辨率,封闭环境室符合最严格的高级掩膜版技术使用的要求。由于速度快、系统价格具有吸引力且运行成本低,大尺寸VPG+系列是大尺寸掩膜版应用中最具生产力的解决方案。

VPG+1400是我们最大的系统,尤其适用于显示器领域的应用,如TFT数组、彩色滤光片和ITO,并具有特别强大的环境室、分差干涉仪,分辨率高达1.2nm,以及先进的Mura校正能力。

Our Large Area VPG+ systems are perfectly equipped for applications such as photomask fabrication for advanced packaging, semiconductors, displays, color filters, LEDs, and touch panel applications. The systems support all industrial data formats and offer Mura optimization functions ensuring excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for use in advanced photomask technology. Because of their speed, attractive system price, and low running costs, the Large Area VPG+ series represents the most productive solution for large area photomask applications.

The VPG+ 1400 is our largest system and particularly aimed at applications in the display industry: FPD applications like TFT-arrays and color filters, and ITO. The VPG+ 1400 features a particularly powerful environmental chamber, a differential interferometer with a resolution down to 1.2 nm, and advanced Mura correction capabilities.

突破掩模版的限制、成本和延迟。VPG 300 DI 是一款高性能直写光刻系统,助您将创新周期从数周缩短至数小时。VPG 300 DI融合传统i-line步进式光刻机的精度优势和无掩模工作流程的强大优势,使研发周期能够以无与伦比的速度和灵活性,直接在最大 300 毫米的晶片直写,绘制高分辨率微结构图案。

步进式光刻的精度,直写技术的自由

VPG 300 DI完美弥合研发与生产的差距。它既具备基于掩模版的步进式光刻机所拥有的亚微米级分辨率和严格套刻精度,又彻底消除了掩模版采购带来的高昂成本与交期延误。这使它成为快速原型、工艺开发和需要频繁设计迭代需求的理想解决方案。

从 CAD 设计到曝光只需几分钟,而不是几周

VPG 300 DI让您实现设计构思的即时转化,将传统数周周期压缩至分钟级别。先进光学引擎支持每日测试新设计,彻底改变加快开发进度。

  • 高速曝光:
    定制的空间光调制器 (SLM) 和优化的数据路径,使您只需 9 分钟即可写入 100×100 mm²的区域。

  • 无缝大面积加工:
    支持无尺寸限制的大面积器件制备,彻底规避步进式光刻固有的拼接误差。

  • 即时更改设计:
    CAD 文件修改立即开始曝光。无需经历新掩模版订购、等待、检查和存储。

实现卓越的特征保真度

您的研究需要极致精度。VPG 300 DI基于成熟的VPG+平台打造,配备高稳定性Zerodur®载台,即使是要求最严苛的微结构也能提供出色质量。

  • 高分辨率:
    稳定制备500纳米以下的精细结构。

  • 卓越的边缘质量:
    边缘粗糙度< 40 nm (3σ)。

  • 出色的CD均匀性:
    嚴严格的工艺控制,CD 均匀度< 50 nm (3σ)。

智能工具赋能复杂器件制造

从多层MEMS到先进封装工艺,VPG 300 DI配备精密的系统解决方案,确保整个基板范围内的完美对准和聚焦。

  • 自动多层对准:
    实现正面对准精度达 100 nm。该系统还支持埋入结构优化设计,支持可见光(VIS)与红外(IR)双模式背面对准。

  • 动态自动对焦:
    可选择光学或气动自动对焦模式,动态补偿晶圆翘曲或形貌变化> 160 µm,确保全域对焦清晰。

  • 综合计量:
    实时测量位置、关键尺寸(CD)及边缘粗糙度,提供即时的工艺反馈。

  • 环境稳定性:
    带有软件补偿功能的集成流场控制箱和环境传感器,可确保长期稳定的写入结果。

准备好突破掩模版工艺瓶颈了吗?

VPG 300 DI将如何革新您的制造流程?请联系我们的技术专家,了解直写光刻技术如何加速您的研发突破。

PRODUCT HIGHLIGHTS

Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively Minimum feature size: Down to 0.75 μm Address grid: Down to 12.5 nm Maximum write speed (at structure size 4 um): 13500 mm²/min Exchangeable write modes Real-time autofocus system High power DPSS laser with 355 nm wavelength Camera system for metrology and alignment Closed-loop climate chamber Automatic substrate loading system Stage map correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber)

Maximum substrate size: 800 x 800 mm² / 1100 x 1100 mm² / 1400 x 1400 mm² Minimum feature size: Down to 0.75 μm Maximum write speed (at 4 μm feature size): 16500 mm² / min Real-time autofocus system High power DPSS laser with 355 nm Camera system for metrology and alignment Closed-loop environmental chamber Automatic substrate loading system Stage map correction Mura correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber files)

曝光速度
100×100 mm²区域写入仅需9分钟
曝光质量
边缘粗糙度<40nm,CD 均匀度 <50 nm,分辨率< 500 nm
对准精度
第二层正面对准精度达 100 nm,背面 VIS / IR ±1 µm
智能对准系统
全局/局部自动对准及畸变校正;VIS 背面对准;红外(IR)对准适用于埋入结构
自动对焦
可选光学/气动对焦模式,动态补偿能力 > 160 µm
集成计量功能
实时监测位置、CD及边缘粗糙度
写入的稳定性
集成环境计量、流场控制箱和软件修正功能,以补偿环境变化

AVAILABLE MODULES

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor

Automatic handling options
Open frame handling with SEMI standard carriers and prealigning available for 100 to 200 mm or 200 / 300 mm standard wafers (others on request)
Two write modes to choose from
High NA for highest resolution or lower NA optimized for throughput or DOF critical applications
Alignment options
VIS and IR backside alignment
Service Contracts
Worldwide service level agreements for faster on-site support and access to spare parts