ULTRA

半导体产业无掩模生产设备

THE SEMICONDUCTOR LASER MASK WRITER
PSM 二次套刻解决方案

ULTRA系统针对半导体产业制造无掩模,提供了经济实惠的激光直写生产无掩模方案,拥有高通量、高精度和结构均匀性,以及极其精确的对准功能。由于其现代化、紧凑的结构,您可以轻松将系统整合到现有的无掩模制造基础设施中。

现今,无掩模在半导体器件制造中仍然是重要的组成环节,被广泛应用在电源、微控制器、LED照明、物联网、微机电、汽车工业等领域。 ULTRA系统支持结构尺寸低于500nm,速度最快高达每分钟325 mm²或580 mm²(取决于写入模式),同时具有优秀的均匀性、高品质图像、多层套刻精度以及重复定位精度。

The ULTRA specifically addresses the production of mature semiconductor photomasks. It provides an economical mask writer solution with all the features you require for high throughput, high precision and structure uniformity, and extremely accurate alignment. With its modern, compact build, you can easily incorporate the system into an existing mask shop infrastructure.

Mature photomasks continue to be a vital component in semiconductor device fabrication, being used in power management, microcontrollers, LED lighting, the IOT, MEMS, the automotive industry, to name but a few. The ULTRA serves this market with structure sizes down to 500 nm and write speeds up to 325 mm2 or 580 mm2 per minute depending on write mode, while featuring excellent values for CD, image quality, overlay, and registration.

KEY FEATURES

Maximum substrate size: 9" x 9"; optional: 17" x 17" Minimum feature size: 500 nm Address grid down to 5 nm High-speed optical engine Customized UV optics (0.9 NA objective lens) 20 nm line edge roughness Input formats: All standard formats, e.g. GDSII, OASIS Overlay of 30 nm Economical, high-power UV laser 100 nm 2nd layer alignment Automatic mask loader CD uniformity of 30 nm SECS / GEM protocol High-speed data path for all types of pattern

Application

Micro-optics MEMS Display Micro sensor

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Fact Sheet