桌上型µMLA系统拥有我们最先进的无掩膜激光直写技术，是所有需要微结构的研究单位和开发领域的完美入门工具，例如微流体学、微光学、传感器、微机电系统和材料科学等。µMLA具有前所未有的灵活性和可定制性，并且可支持使用毫米(millimeter)大小范围样品。
选择所需的曝光模式，甚至可以选配两种模式：光栅扫描光刻模块，快速曝光复杂的图型；向量光刻模块，创建光波导的平滑轮廓。此外，µMLA提供2种光学设置选择，具有不同的通量和可变分辨率范围。在您的光学设置内，软件可轻松切换三种配置，根据您的要求优化分辨率和速度。
NEW: The table-top system µMLA features our state-of-the-art maskless technology and is the perfect entry-level tool for Research & Development, in virtually all areas that require microstructures. Typical examples are Microfluidics, Micro Optics, Sensors, MEMS, and Material Science. The µMLA is flexible and customizable like no other table-top direct writing tool before and supports the use of millimeter-sized samples.
Select the exposure mode you need or even equip your µMLA with both: The Raster Scan Exposure Module provides fast exposure with a speed independent of design complexity. The Vector Module exposes continuous curves, creating smooth contours vital for applications such as waveguides. In addition, the µMLA offers a choice of 2 optical setups with different ranges of throughput and variable resolution. Within your optical setup the software allows easy switching between three configurations, optimizing resolution and speed according to your requirements.
MLA150专为研发及中小批量生产的客户而设计的激光直写系统，满足实现非接触曝光、卓越易用性和快速等功能，成为低至中批量生产和研究开发中的理想工具。
无掩膜光刻技术屏除了掩膜版的需求：系统直接将图案曝光在覆盖有光阻的基材表面上。如果需要进行设计修改，只需要更改CAD布局即可快速实现，周期时间大大缩短；优点还有快速自动化的正反面对位程序和高效率：曝光100 x 100 mm²的面积，即使是1µm的结构也只需要不到10分钟。MLA150的应用领域包括生命科学、微机电系统、微光学、半导体、传感器、微光机电系统、材料研究、纳米管和石墨烯等科研领域。
The MLA150 has been specifically designed for easy operation and includes all our know-how on developing maskless lithography systems that we have gathered in the past 30 years. It offers all the capabilities that are required for single layer and multi-layer applications and because the MLA150 exposures are always non-contact it will even overcome some of the limitations of photomask based exposure technologies.
What sets the MLA150 apart from other pattern generators is not only the usability but also the extreme exposure speed. Exposing an area of 100x100mm² with structures as small as 1 micron will take less than 10 minutes – independent of the fill factor or number of structures within this area. Alignment in multi-layer applications is achieved within 2 minutes by using three integrated cameras with varying resolution. Layer to layer alignment accuracy is better than 500nm and does not depend on the operator’s level of training.
Experience the flexibility that the MLA150 Maskless Aligner will provide and expose your layout directly to accelerate your work in the areas of Life Science, MEMS, Micro-Optics, Semiconductor, Sensors, Actuators, MOEMS, Material Research, Nano-Tubes, Graphene, and any other application that requires microstructures.
MLA300是Maskless Aligner的工业级别生产系统，已成为研究开发应用、快速原型设计和低至中等产量生产的标准设备。MLA300以高速和高吞吐量实现2µm的最小线宽和间距，并具有全自动化的芯片自动装取装置，以及针对生产环境设计的软件，提供简单的自动化工作流程；同时，还具备无掩膜光刻机的所有优点，省去采购掩膜版及处理、清洁和存储所需的费用和开销。
无掩膜对位技术使用空间光调制器，如同动态的掩膜版。它提供具挑战性的灵活性，允许每个芯片进行图案校正（例如，对应变形或工艺变化做出反应），并采用实时自动对焦跟踪基板的弯曲或波纹。曝光模式可选择不同波长（375 nm或405 nm）和分辨率选项，多个曝光模块可以安装在MLA300中，实现更高的通量产速。
MLA300在生产传感器、微机电装置、离散电子组件、集成电路、集成电路(ASIC)、功率电子、OLED显示器以及先进封装应用等领域表现优异。
The MLA300 is the industrial production version of the Maskless Aligner, which already has become a standard in Research & Development applications, rapid prototyping, and low-to mid-volume production. The MLA300 achieves high resolutions of 2 µm lines and spaces at the high throughput and high availability expected in production. It features full automation with wafer robot and load ports, and software specifically designed for the production environment to offer a simplified automated workflow.
At the same time, it features all the advantages associated with maskless lithography: Overheads and expense associated with the procurement of masks, and their handling, cleaning, and storage are eliminated.
The Maskless Aligner technology uses a Spatial Light Modulator which essentially acts like a dynamic mask. It offers the flexibility to structure the most challenging substrates, allowing per-die pattern corrections (e.g. to react to distortions or process variations), and employs a real-time autofocus to follow substrate warp or corrugations. The fully integrated exposure modules are available for a selection of wavelengths (375 nm or 405 nm) and with different resolution options. Multiple exposure modules can be mounted in the MLA300 for even higher throughput.
The MLA300 excels in application areas such as the production of sensors, sensor ICs, MEMS devices, discrete electronic components, analog and digital ICs, ASICs, Power electronics, OLED displays, as well as for advanced packaging applications.
