DWL 66+

DWL 2000 GS
DWL 4000 GS

多功能激光直写光刻机
专业型灰度光刻机

THE ULTIMATE LITHOGRAPHY TOOL
直写模块及灰度光刻-实现各种精度需求

HIGH RESOLUTION PATTERN GENERATORS
高分辨率灰度光刻系统

DWL 66+系统是一款经济实惠、高分辨率的激光直写光刻机,拥有多种选配功能,例如前后对位和激光波长可选择的405 nm或375 nm;进阶选配项目有绝对位置校准和自动加载系统。共有六种不同的执行模块可选用,其中包括分辨率为300 nm的高分辨率模块。值得关注的是DWL 66+在灰度光刻模块下呈现出卓越的性能,从标准到专业级别:此多功能技术用在低对比度的正型光阻厚膜工艺,可以创建复杂的2.5D微结构,例如微透镜、DOE、全息图和纹理表面。

DWL66+的高度灵活和可定制的系统,可以根据您的应用特制,运用在生医工程、先进封装、微机电(MEMS)、微光学、半导体以及所有需要微结构领域中的必备光刻研究工具。

The DWL 66+ laser lithography system is an economical, high-resolution pattern generator for direct writing. The system features powerful options such as front- and backside alignment and a choice of 405 nm or 375 nm laser wavelength. Further advanced options include an absolute position calibration and an automatic loading system. A total of six different Write Modes are available, amongst them the High-Resolution Mode with a resolution of 300 nm. Notably, the DWL 66+ presents the ultimate performance in Grayscale exposure mode, from Standard to Professional levels: This versatile technique for the creation of complex 2.5D microstructures in thick layers of low-contrast positive photoresists is used for applications such as micro-lenses, DOEs, holograms (CGHs), and textured surfaces.

This highly flexible and customizable system can be specifically tailored to your application – the sophisticated capabilities of the DWL 66+ make it the essential lithography research tool in Life Science, Advanced Packaging, MEMS, Micro-Optics, Semiconductor and all other applications that require microstructures.

DWL 2000GS和4000 GS 激光直写系统具有快速、灵活的高分辨率,能够达到灰度光刻的专业表现。灰度光刻能够在厚度较大的光阻中创建复杂的2.5D微结构。灰度光刻模块的最常见应用包括制造用于通信或微光機電的晶圆光学组件;也被用于显示器制造和生医科学设备的制造。

除了灰度光刻外,DWL系列还能以最高分辨率的500 nm最小特征大小进行二进制2维光刻。这些系统提供了完美的解决方案,如果您需要在微机电(MEMS)、BioMEMS、微光学、集成电路(ASIC)、微流道、传感器和全息图等领域中,对掩膜版或芯片进行高通量的图案,它们的书写区域可达400 mm x 400 mm,并带有选配自动加载系统。

The DWL 2000 and 4000 laser lithography systems constitute fast, flexible high-resolution pattern generators, capable of the Professional performance level of Grayscale Lithography. The latter allows the creation of complex 2.5D structures in thick photoresist over large areas. Most common applications of the Grayscale exposure mode include the fabrication of wafer level optics used for telecommunication or illumination market segments; it is also used in display manufacturing, and in device fabrication in Biology and the Life Sciences.

In addition to Grayscale, the DWL series tools excel at binary 2D exposures, down to the highest resolution with a minimum feature size of 500 nm. With a write area of up to 400 mm x 400 mm and the optional automatic loading system, these systems provide the perfect solution if you require high-throughput patterning of masks and wafers in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, and CGHs.

Function

Maximum exposure area: 200 x 200 mm² Maximum substrate size: 9" x 9" Multiple Write Modes Minimum feature size: down to 300 nm Maximum write speed (at 4 µm feature size): 2000 mm²/min Address grid down to 5 nm Grayscale exposure mode with up to 1000 gray levels Vector and Raster scan exposure mode Multiple data input formats Front- and backside alignment Climate chamber Two choices of laser wavelength (405 nm or 375 nm) Real-time autofocus system Scripting capability Integrated camera system for measurement and inspection

Maximum exposure area: up to 400 x 400 mm² Maximum substrate size: 17" x 17" Professional Grayscale Mode Multiple Write Modes Minimum feature size down to 0.5 µm Maximum exposure speed (at 1.3 µm feature size): 370 mm²/ minute Address grid down to 5 nm Modular configuration concept to fit customer application Realtime autofocus Stage map correction Camera system for measurement and inspection Automatic loading system Customer specific laser Multiple data input formats (DXF, CIF, GDSII, Gerber, STL, BMP)

Application

MEMS BioMEMS Micro Optics ASICs, Micro Fluidics Sensors, CGHs Micro sensor

MEMS BioMEMS Micro Optics ASIC Micro Fluid Micro sensor CGH