Ion Beam Milling (Etching) System 离子蚀刻系统     As a micro fabrication method, Ion beam milling system is adopted to wide variety of applications such as RF devices, Sensors, Magnetic devices for R&D and mass production. Difficult-to-Etch materials (Au, Pt, Magnetic material, thin metal multi layers) can be easily processed by physical etching process (no reactive chemical).         Features of ion beam milling equipment     Planetary Stage   Planetary stage is employed in all type of systems for production. Thanks to planetary movement of stage and wafer holder, excellent milling uniformity is achieved.     Direct Cooling or Indirect Cooling Stage   Direct cooling circulates cooling wafer inside wafer holder for excellent cooling performance. Indirect cooling enables the change of size and number of wafer holder easily.     Dry Chuck   Wafer chuck with Dry Chuck Rubber incorporating metal powder ensures a good thermal conductivity and wafer attachment. Suitable rubber is available depending on the material of a sample.     Design Freedom   We respond to customer's specific requirement as completely as possible in designing of system and offer custom-designed ion beam milling system.           10IBE For R&D．Small Chamber           Features     Suitable for R&D. Small foot print             4cm / 8cm / 10cm / 16cm Kaufman type ion source applicable           Wafer size x number : Up to Φ8" x 1wfr     Sample that is other than the shape of wafer is mountable with adaptor           End point detector (optional) for precise ending of etching                                                                       Φ2" single stage                     20IBE-C For R&D / Production．Medium Chamber           Features     Applied in a wide range from R&D to production             20m Kaufman type ion source equipped     Wafer size x number : Φ3" x 8wfr, Φ4" x 6wfr etc...     Planetary movement achieves excellent milling uniformity                                                                     Φ4" x 6wfr Planetary Stage                         20IBE-J For Production．Large Chamber           Features     Having enough processing capacity in a batch             20m Kaufman type ion source equipped     Wafer size x number : Φ4" x 12wfr, Φ5" x 10wfr, Φ6" x 8wfr etc...           Planetary movement achieves excellent milling uniformity                                                               Φ4" x 12wfr Planetary Stage